Technology capability:
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Layer counts
|
2~56
|
|
Board thickness
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Max.: 4.0mm
|
|
Min.: 0.2mm
|
|
|
Drill Hole size
|
0.2mm
|
|
Aspect Ratio
|
10:1
|
|
Board Diamension
|
Max.: 610mm×450mm
|
|
Line width/space
|
Inner layer: 4mil/4mil
|
|
Outer layer: 4mil/4mil
|
|
|
Impedance Tolerance
|
±10%
|
|
Min Core Thickness
|
3mil
|
|
Surface Finishing
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HAL-LF, Immersion Au, Immersion Ti, OSP etc.
|
|
Materials
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CEM-3, FR4, Hi Tg FR4, Halogen Free FR4, PTFE
|
